Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

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Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Product information

Author:

Type: Hardback

ISBN: 9783032203175

Date: 27th March, 2026

Publisher: Springer

  1. Categories

  2. Cybernetics
  3. Electronics Engineering
  4. Circuits And Components

Description

This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today's society.

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